Offset Printing

SuperCorrExpo 2021 delegates to gain insight to BOBST industry-transforming innovations

Thursday 22. July 2021 - BOBST has announced that it will showcase some of its latest technologies and solutions at this years SuperCorrExpo. The event takes place August 9-12, 2021, at the Orange County Convention Center in Orlando, Florida, and the BOBST team will be on Booth 2411.

Brian Kentopp, Zone Business Director, Folding Carton & Corrugated Board at BOBST, said: “Our vision is about creating change within the packaging world that enhances, enables and reflects the key industry drivers of connectivity, digitalization, automation and sustainability. “We cannot wait to once again meet customers and partners in person at SuperCorrExpo and provide insight to what our vision will look like in reality for corrugated packaging manufacturers. We are completely focused on bringing technologies and machines to market that truly address the challenges of the industry today and into the future. SuperCorrExpo will provide delegates with a fantastic opportunity to see how our vision is evolving and how they can be part of it.”
Two of the newest innovations include the pioneering BOBST MASTERCUT 1.65 PER flatbed die-cutter and SPEEDPACK automatic packer. Designed to support converters achieve higher quality, more efficient and sustainable products and processes, these game-changing technologies will be showcased to event visitors. BOBST MASTERCUT 1.65 PER, set to be launched in early 2022, is a unique solution that has been specially designed for litho-laminated converting. It handles all corrugated board, carton and litho-laminate equally well, making this machine a sound investment choice for converters seeking a flexible, best-in-class die-cutting solution. Combining the advantages of folding carton and corrugated board flatbed die-cutters, it can process both robust and delicate materials, going from 300g solid board to BC double wall litho-laminated. It offers extremely precise, high-quality die-cutting, even for complex box designs and delicate substrates, thanks to a sheet-to-sheet top feeder, a specially adapted POWER REGISTER and its high cutting force. The BOBST MASTERCUT 1.65 PER is the only solution on the market for blanking in size VII and offers the possibility to deliver single cut, double cut and full sheets. Its exceptional ergonomics, accessibility and optimal level of automation, as well as the intuitive HMI SPHERE, also allow fast and easy handling for maximum productivity.
Meanwhile, for folding-gluing lines, BOBST is soon to launch the SPEEDPACK. Visitors to the BOBST stand will be able to find out more about this automatic packer that complements the BOBST EXPERTFOLD 145/165, the EXPERTFOLD 170-350 and the MASTERFOLD 170-350 and enables corrugated converters to realize the full potential of their folding-gluing lines.nThe versatile SPEEDPACK can handle all types of boxes, whether corrugated, litho-laminated, straight-line, 4&6 corners, or crash-lock bottom. With the highest possible number of batches per hour and very short set-up times, SPEEDPACK significantly increases productivity while preserving box quality. Folded and glued boxes are automatically counted, stacked and banded, and perfectly formed bundles are delivered, ready for palletization.
BOBST will also showcase the BOBST FFG 8.20 EXPERLINE flexo folder-gluer which offers unparalleled flexibility and heightened efficiency to the production line. It is a high-speed box-making solution that is able to process up to 24,000 boxes/hr across a wide range of corrugated flute types, including single and double wall boards. Designed to be intuitive and bring additional value to the supply chain, this flexo folder-gluer combines automation, accuracy and quality in one machine to offer superb return on investment. It also boasts ultra-quick setting up times, or order changeover during the run, of just two minutes with Rapid-Set.
SuperCorrExpo will take place August 9-12, 2021, at the Orange County Convention Center in Orlando, Florida.

www.bobst.com
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