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Home » Packaging
Packaging
Friday 26. September 2008

Dr Pepper Snapple Group Realigns Finished Goods Business and Announces Other Organizational Changes

Moves Designed To Increase Focus on Key Customers And Capitalize on Company-Owned Distribution Network

Friday 26. September 2008

MWV Introduces Tear Test Specification Grades to Increase Security Options for its Natralock Packaging

Global packaging solutions leader MeadWestvaco Corporation (NYSE: MWV) has introduced three grades for its Natralock Security Packaging to give customers and brand owners greater flexibility surrounding their desired level of product security and brand protection. Natralock packaging is offered in three different tear-resistant grades along with a variety of substrate selections, including MWV Printkote SBS, Printkote Eagle, Custom Kote CNK, and Kraftpak.

Friday 26. September 2008

Seasonal Sharing Tub Works a Treat for Halloween

A new seasonal launch for Halloween from Fox’s Party Rings has confirmed the suitability of RPC Containers Blackburn’s large-sized Thor Pot for the convenient sharing of snacks.

Friday 26. September 2008

INNOVATION AND CREATIVITY AT LABELEXPO AMERICAS

Labelexpo Americas 2008, the largest event for the label, web printing, product decoration and converting industry in the Americas, took place in Chicago between 9 and 11 September.

Friday 26. September 2008

Emballage 2008 : International Package Design Symposium

The Pack.Vision Symposium, the first International Package Design Symposium, gathers the key players in package innovation within the exhibition EMBALLAGE 2008. Packaging manufacturers, design agencies, trends firms, representatives of the major international brands, and major industry associations will meet in Paris from next November 17th-21st to share their expertise about future packaging challenges.

Friday 26. September 2008

CoorsTek Launches New MetaPlast(R) II Spring-Energized Seals

Next-generation spring-energized sealing technology designed for high-performance aerospace applications

Friday 26. September 2008

Quik-Pak Acquires Flip Chip Assembly, Radiation Sensor and Laser Micromachining Business Units of Aguila Technologies

Quik-Pak, a division of Delphon Industries, announced today the acquisition of Aguila Technologies’ flip chip assembly, detector array processing, and laser micromachining business units. The acquisition is part of Quik-Pak’s ongoing effort to expand its advanced packaging and assembly services.

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