Packaging
Omet shakes hands on a partnership – with Clemson University, USA
Friday 02. October 2009 - Quality in an organization is dependent on its resources, people, and the relationships it creates. And when relationships become partnerships, doors can open, allowing for something special to transpire. In one such partnership, between an American institution of higher learning and an Italian press manufacturer, a unique situation has developed, creating new opportunities in education, packaging, printing and business.
Clemson University, located in Clemson, SC, USA, is an institution acclaimed for its focus on printing and packaging studies. The university recently welcomed a new addition to its facilities, opening the doors to the brand new Sonoco Institute of Packaging Design and Graphics. The institute is poised to become the global leader in packaging design and graphics technology and research, and a major contributor to the institutes endeavors is Omet, the award winning press manufacturer based in Lecco, Italy. A true partnership has developed between Omet and the Sonoco Institute, and its centerpiece is the installation of an Omet VaryFlex VF530-F1 seven-color press at the Institute. The press, which Omet has donated to the school, will be housed in the brand new Harris A Smith building located on Clemsons campus.
Specific to the Institutes focus on packaging science and graphic communications, a strong emphasis will be placed on printed electronics. The VaryFlex press, owing to its extraordinary capabilities, is a perfect fit to meet the institutes needs. The press includes seven printing stations that can be configured for rotary screen, flexography or gravure, with a variety of solvent, water based and UV curable ink systems. The press platform can handle polymer substrates as thin as 12 microns, or paperboard materials as heavy as 600 microns, while achieving high end registration through a complete servo controlled system.
The flexibility of the press was one aspect that drew the institute to Omet, particularly when it comes to the needs of printed electronics applications. “When we were looking for a company to partner with, we were looking for one that could support our flexible packaging needs, both solvent and water based, and multiple processes ¬- both gravure and flexo. With printed electronics, you need to have variable printing processes and the ability to mix and match,” said Chip Tonkin, Director of the Sonoco Institute.
At the 2008 Drupa exhibition, Tonkin met Marco Calcagni, Omets Sales Director, and explained to him the Sonoco Institutes direction and philosophy. Here, the seeds for the partnership were planted. “Upon speaking with Mr Tonkin about Clemsons project, I was immediately drawn to it for two reasons. First, cooperating with a university is very important to the development of new technology. Also, it became clear that this would be an excellent opportunity for Omet to increase its presence in North America,” said Calcagni.
The VaryFlex press is also poised to expand as needed, in order to meet the needs of the Institute. Amerigo Manzini, R&D manager for Omet, talks about the machines versatility and potential. “The VaryFlex is a true multi substrate press with the ability to print on any substrate from .5 mil unsupported film to 24 pt board. It offers combination printing with HD flexo, screen cassettes, gravure cassettes, and hot/cold foil cassettes that can slide in to any station on the press. Additionally, Omet has an offset print station that can be added to the VaryFlex to make it an even more versatile platform. The press platform at Clemson will change and expand as Clemsons requirements grow,” Manzini said.
Tonkin emphasizes that while the press is a remarkable fit for the Institute, there are other intangible factors that make Omet the true partner the Institute was looking for.
“Once we put together our requirements, we realized that there were really only a handful of companies that had the capabilities we desired, and from a partnership standpoint, a company that would benefit from what we have to offer. We wanted a company with vision, one that would raise the bar of research and learning, and one where we could get immersed in each others R&D. Omet has that vision and that desire,” Tonkin said
The R&D the Sonoco Institutes students and teachers, as well as Omets team look forward to, is based on what Tonkin describes as the schools holistic approach to packaging design. He says the Institutes four areas of focus are packaging design workflows, sustainability, the consumer experience, and printed electronics.
“Were the only facility of its kind with these capabilities,” Tonkin said. “We have everything under one roof ¬- the lab, prepress equipment, and the Omet press. Our pitch to the industry is that you can come here to Clemson and make your ideas work,” he added, saying that plans include the printing of solar panels and lighting.
Omets engineering team is looking forward to cooperating with Clemson to develop and test new packaging technologies and processes, especially concerning printed electronics, Manzini says, and is enthusiastic about the partnership. “The ability to partner with Clemson at the new Sonoco Packaging Institute is very exciting. This will be a cutting edge facility that will push the boundaries of packaging. We are an engineering focused company and innovation is our passion, and this matches well with the focus of the institute,” he explained.
A true partnership is a mutually beneficial relationship, and in addition to sharing in R&D endeavors, another purpose is being served on the business end of Omets operations. The facility at Clemson will also serve as Omets North American press demonstration and training center, giving the company a permanent home at one of
the most distinguished graphic arts universities in North America, thus providing the opportunity to expand the companys presence across the Atlantic.
“North American customers are more receptive to traveling to a US based facility for demonstrations, than traveling to Europe. This makes it easier for these customers to see first hand the quality, dependability and flexibility of Omets VaryFlex platform. In effect, the cooperation with Clemson also provides US converters with a well recognized North American graphic arts university that can provide independent assessment of the Omet VaryFlex platform performance,” Manzini concluded.
Omet also plans to run print demonstrations for future customers on the VaryFlex, and training seminars for existing VaryFlex customers, as well as seminars for the converting and packaging industries.
“North America is one of the worlds most important markets, and this is a major reason Omet has decided to invest its time and money in this project,” Calcagni said, adding, “The relationship between Omet and Clemson University demonstrates that cooperation between industry and education can produce significant technological developments.”