Packaging

Jeco Engineer Speaks at Denver Computing Forum

Thursday 21. November 2013 - Paul Thompson, Jeco Plastic Products Chief Engineer, addressed the International Conference for High Performance Computing, Networking, Storage and Analysis in Denver, Colorado, the week of November 17, 2013. 

At the meeting, where more than 11,000 scientists, engineers, software developer, and information technology administrators from around the world gathered, Thompson discussed how Jeco Plastic Products collaborated with Purdue University and the National Digital Engineering and Manufacturing Consortium to perform stress calculations and demonstrate to Jeco customers that plastic pallets can perform as well as metal pallets in many situations.  Using high performance computing and finite element analysis, Jeco engineers were able to significantly strengthen an existing pallet design by using detailed three-dimensional models to evaluate potential structural changes.
Commenting on the meeting, Jeco Plastic Products CEO Craig Carson observed: “Jeco Plastic Products was honored to join leading companies such as Dow Chemical, Proctor & Gamble, Deere & Company, and AstraZeneca on the podium at this prestigious conference.  Our access to computing power through Purdue University and the National Digital Engineering and Manufacturing Consortium enable Jeco to compete in the worldwide marketplace and bring new business to Indiana.”