Packaging
DOW CORNING TO EXHIBIT AT LABELEXPO ASIA 2009, STAND E1-B20
Thursday 19. November 2009 - Dow Corning Corporations pressure sensitive team will showcase its proven release coating solutions, including Syl-Off Advantage Series, Syl-Off Advantage Emulsion Release Coating System and Syl-Off thermal-cure release coatings systems for filmic substrate at Labelexpo Asia this December.
Dow Cornings Advantage Series is an extensive line of ultralow-platinum, solventless release coating products. The Advantage Series can help significantly lower costs by reducing platinum levels. The product line offers high line speeds, anti-misting, excellent anchorage, outstanding converting properties and better coverage, bath life and release stability.
“The Advantage Series gives our customers many choices to meets their needs,” said Jun Liao, Dow Cornings global paper industry director. “As an innovation provider, Dow Corning is committed to developing additions to its Advantage Series product line – which now requires lower platinum levels and can be used on a wider range of substrates.”
In addition, Dow Corning will feature its new technologies, such as high-performance PSAs for Asias high-end electronic and automotive markets. The company also will highlight its silicone pressure sensitive adhesives and release coating solutions, including the Syl-Off Advantage Emulsion Release Coating System – a release coating system that gives customers application flexibility, high line speeds and flat release – and Syl-Off thermal-cure release coatings, which is specially designed for filmic substrates.
Visit Stand E1-B20 at Labelexpo Asia to learn more about Dow Corning and its innovative silicone solutions. Labelexpo Asia will take place December 1-4, 2009 at the Shanghai International Expo Center.