Packaging

Quik-Pak Offers Complimentary Plastic IC Packages for Assembly Customers

Friday 20. February 2009 - Quik-Pak, the leader in quick-turn IC prototype packaging and assembly, is offering complimentary open-cavity plastic packages (OCPP) for a limited time on prototype IC assembly orders. Through March 31, 2009, any customer who sends wafers or die to Quik-Pak for assembly will receive open-cavity plastic packages at no charge.

“We value our customers’ loyalty to Quik-Pak,” says Steve Swendrowski, General Manager. “We want to express our appreciation in a way that will help them succeed.” This special pricing is offered to new and current customers.

Quik-Pak has a patented, proprietary process that takes customers’ packages and reconfigures them for the assembly of the new die into the same package. Quik-Pak has an extensive inventory of package configurations to meet specific customer applications. The packages are identical to packages that will be used in high-volume production, thus eliminating the performance variables that are introduced by using non-production packages for prototype devices.