SLEEVE LABELS AND IN-MOLD TECHNOLOGIES
Two back-to-back events focussed on leading-edge packaging technologies hosted by AWA Conferences & Events
Two back-to-back events focussed on leading-edge packaging technologies hosted by AWA Conferences & Events
Sonoco (NYSE: SON), one of the largest diversified global packaging companies, today reported financial results for its fourth quarter and full-year 2012.
The L9 associations are pleased to announce the results of the 2012 World Label awards competition judged by an international jury during Labelexpo in Chicago in September 2012. T
Allen Datagraph Systems, Inc. to launch high speed iTech AXXIS HS Digital Label System at WestPack 2013
– The company’s Elgin, Ill., food and aerosol packaging plant will cease production in December 2013
The Annual General Meeting of Shareholders of Huhtamäki Oyj will be held on Thursday, April 25, 2013, at 2.00 p.m. at Kulttuuritalo (Helsinki Hall of Culture), at the address Sturenkatu 4, Helsinki, Finland.
Edale look forward to welcoming visitors to their booth at the forthcoming Gulf Print & Pack show, held at Dubai World Trade Center between 8-11 April 2013.