Mitsubishi Electric Automation, Inc. is maintaining its attendance at the PACK EXPO show in Chicago, IL, this year to demonstrate new and exis- ting automation solutions for consumer-packaged goods and life sciences customers and OEMs.
Over 250 exhibitors will be participating including HP & TechNova Imaging Systems, Avery Dennison, GEW, Multitec, Monotech Systems, RK Label Printing Machinery, Jindal SMI, Vinsak, Weldon Celloplast, Domino Printech, Konica Minolta India and Maxcess India.
The deal aims to develop joint international promotion and step up cross-selling activities for their trade fair portfolios, including the Propak and Fispal platforms operated by Informa Markets and the trade fairs organised by Ipack Ima.
Originally launched over a decade ago as Packaging Innovations & Luxury Packaging London, the event has evolved into a dynamic platform for brands, packaging designers, technologists, and suppliers to connect and innovate.
Leading global event organiser Easyfairs, in collaboration with ThePackHub and awards sponsor Ocado Retail, is thrilled to announce that the 2025 Packaging Startup Awards, a global competition celebrating innovation in the packaging industry, is now open for entries.
The preparations for K 2025 in Düsseldorf are in full swing, the exhibition space is already fully booked. Numerous proven and new specials hone in on the motto The Power of Plastics! Green – Smart – Responsible. The exhibitor database will go live in January 2025.
interpack and the World Packaging Organisation (WPO) are intensifying their long-standing cooperation. The aim of the strategic partnership is to promote innovation, sustainability and the global exchange of knowledge in the packaging industry even more strongly.
