Following customary closing conditions and local regulatory approvals, AR Packaging announces the completion of the acquisition of rlc packaging group, including indirectly a significant share in BSC Drukarnia Opakowa S.A., and Nampak Cartons Nigeria Limited.
Xaver Egger, expert for high-quality packaging, reveals the eight most important packaging trends for 2020: Daily contact with our customers from various industries shows us every year the direction in which things will go, explains Xaver Egger, Managing Director of EGGER Druck + Medien. The packaging year 2020 will definitely be an exciting year. Minimalist, environmentally friendly and provided with a gripping story – we are already looking forward to the many different designs, colours, constructions and finishes.
Industry knowledge platform GlobalQuality.space is gold sponsor and keynote speaker for this years Label Summit Latin America, which returns to Chile. The annual two-day rotating conference and exposition, which takes place at Espacio Riesco Convention Center in Santiago between 10-11 March, is the leading educational event supporting the label and package printing industry in Latin America.
Markem-Imaje, a global supplier of product identification and traceability solutions, announced today that Dover Corporation (Dover) has entered into a definitive agreement to acquire Sys-Tech Solutions, Inc., dba Systech International (Systech), a leading provider of software and solutions for product traceability, regulatory compliance and brand protection. Following the close of the transaction, Systech will become part of Dovers Markem-Imaje business unit and will offer brand protection, traceability and automation solutions under the Systech brand to customers worldwide.
At the point of sales (PoS) – the place where purchases are made – branded companies compete for the attention of their customers. The winner here is whoever presents their products with eye-catching packaging and labels, because consumers today buy packaging and no longer just the product inside.
New tethered cap manufacturing solutions to be showcased alongside the new range of Flexi labellers, a response to the growing demand for flexibility and performance in the labelling world
Following its successful debut in 2018, the IPACK-Mat project devoted entirely to innovative solutions in the field of high value-added materials will be back at the 25th IPACK-IMA to be held in the Fiera Milano exhibition centre from 4 to 7 May 2021, further expanding the shows scope and contents.
