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Home » Packaging
Packaging
Thursday 19. February 2009

United Business Media International Rebrands Annual RFID World Conference & Exhibition to Include an Expanded Community of Tracking, Tracing and Automation Technologies

RFID World is now RF Edge Expo 2009 – October 12 – 14, 2009, Dallas, Texas

Thursday 19. February 2009

Diamant Art Corporation Announces Evolving Strategy to Raise Global Awareness

Diamant Art Corporation (OTCBB: DIAAF) is pleased to announce that through its wholly owned subsidiary, Bio-Plastics Film Inc., the Company has made recent advancements have with various companies that have considered the Company’s plastic packaging and additive products.

Thursday 19. February 2009

Rohm and Haas Discusses Sustainability at IVP Session in Brussels

“Sustainability has become an important topic in the board rooms and R&D strategy sessions of some the region’s leading paint and coatings companies,” said Dr. Cheryl Martin, Rohm and Haas Company (NYSE:ROH) Vice President and General Manager for the company’s Paint and Coatings Materials business in Europe, the Middle East and Africa.

Wednesday 18. February 2009

New Rockwell Automation Safety Control Solution Helps Improve Worker Safety and System Flexibility in Unwinding and Rewinding Applications

Innovative preconfigured Wind-up and Let-off safety solution helps tire companies address pervasive manufacturing issue

Wednesday 18. February 2009

Oberthur Technologies and NXP Move Ahead With NFC Deployment Compatible With MIFARE(TM) Infrastructures

Greater Flexibility and Convenience for Consumers Using Contactless Technology in Public Transport, Ticketing and Access Management

Wednesday 18. February 2009

Numerex and Savi to Launch GlobalTag Combining GPS, RFID and Satellite Communications

New device will enhance and extend supply chain visibility worldwide

Wednesday 18. February 2009

RFMD(R) Releases Family of WCDMA/HSPA+ Power Amplifier Modules for 3G Multi-Band, Multimode Mobile Devices

RF720x Product Family Is Optimized To Mate With Reference Designs From Industry’s Leading Open Market 3G Chipset Supplier

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