EFIs Breakthrough Innovations at FESPA Include New, Next-generation Hybrid Inkjet Platform and Greener Pigment Process for Textile
Electronics For Imaging, Inc. (Nasdaq:EFII) continues to revolutionise the future of printing by introducing new technologies at this years FESPA Global Expo in Berlin. At hall 2.2, stand B30, EFI will unveil its next-generation hybrid flatbedroll platform technology – the EFI VUTEk h series printers built from the ground up to offer higher quality, more capabilities and better productivity up to 109 boards per hour.