LFP - Large-Format-Printing
SGIA Expo Full Recap and Industry Coverage Now Available Online
Monday 11. November 2013 - The industry's premier event showcased the most innovative technologies in the specialty imaging marketplace
New markets, new attendees and new opportunities were everywhere at the 2013 SGIA Expo (Orlando, October 23-25), and SGIA has released its full recap and industry coverage at SGIA.org. Closing the “monster” Expo with 22,460 attendees (49 percent were first-timers) and 534 exhibitors (on a sold-out trade show floor), the full spectrum of specialty imaging was represented en masse in Orlando last month.
In addition to the strength of the traditional specialty imaging community, the outstanding success of the 2013 Expo was due in part to printing sectors such as commercial lithographers and sign makers that are joining the SGIA community to maximize the use of wide-format imaging technologies. Nearly 45 percent more sign makers attended the 2013 Expo, and 13 percent more lithographers came both sectors within the community that have been growing rapidly in past years.
“Overall, my impression with the show is an outstandingly positive one. The show itself was huge, with booths from every corner of the printing industry displaying their new stuff,” Marshall Atkinson, of Atkinson Consulting LLC, said. “It was a who’s who of printing every 10 feet.”
The highlights included:
A sold-out Expo show floor, featuring some 534 exhibitors
40+ educational sessions boasting record attendance
Innovative, hands-on presentations and demos in our Industry Zones
SGIA’s Keynote Breakfast with Don Hutson
Packed community networking receptions
Product of the Year Award, Golden Image Award and Tom Frecska Student Printing Competition Winners
The Expo co-located at the Orange County Convention Center with the Industrial Fabrics Association International Expo, and for the second year, hosted the Printed Electronics and Membrane Switch Symposium, which opened a day earlier to allow attendees more time on the show floor.