Packaging

Quik-Pak Acquires Flip Chip Assembly, Radiation Sensor and Laser Micromachining Business Units of Aguila Technologies

Friday 26. September 2008 - Quik-Pak, a division of Delphon Industries, announced today the acquisition of Aguila Technologies' flip chip assembly, detector array processing, and laser micromachining business units. The acquisition is part of Quik-Pak's ongoing effort to expand its advanced packaging and assembly services.

The acquisition, which includes key technical personnel and proprietary equipment, enables Quik-Pak to provide a full turnkey solution that supports wafer backgrinding and dicing, the latest packaging technologies and advanced assembly services. “The new acquisition coupled with Quik-Pak’s current services will enable us to more completely meet the increasing demands of our customers and facilitate faster time-to-market for their new products,” says Steve Swendrowski, General Manager.