Packaging

Technologies from GEW to reduce the carbon footprint

Reducing the carbon footprint is very much the theme of the GEW stand at this year’s Labelexpo Americas, where it will feature its e-System range of UV lamp heads with energy saving electronic power supplies that offer the combined benefits of more UV output, low running costs and reduced CO2 emissions.

Tuesday 19. August 2008 - Reducing the carbon footprint is very much the theme of the GEW stand at this year’s Labelexpo Americas, where it will feature its e-System range of UV lamp heads with energy saving electronic power supplies that offer the combined benefits of more UV output, low running costs and reduced CO2 emissions.

The exhibits will be complete with SEECure, on-line UV monitoring through touch screen, a fully integrated UV lamp output monitoring system that runs with the latest generation of GEW’s e-Brick controls.

The company will also introduce its new e-System Inert atmosphere line for the narrow web market for curing inks and coatings on filmic substrates such as in-mould, shrink and stretch sleeves for food packaging. The system enables the use of inks and coating chemistry with reduced levels of low molecular components that minimize the risk of taint and odor migration from the packaging.

View GEW innovations at Booth 3505