Business News

New RadTech Europe Seminar

Friday 30. September 2016 - The highly-important issue of safe printing on food packaging is the subject of a new seminar organised by RadTech Europe (RTE), the European Association for the Advancement of Radiation Curing by UV, EB and Laser Beams. Taking place on 14 October at the Sheraton Frankfurt Airport Hotel, the event will focus on how the entire food packaging value chain - from raw material and ink suppliers and converters to brand owners -- can benefit from the fast-curing and low-VOC print offered by the UV/EB and UV-LED technologies.

From technology to real-life case histories
The agenda is appropriately wide-ranging, covering the latest technological developments; current and expected regulatory and testing requirements; the packaging industry and brand owner perspectives; and real-life case histories, as well as interactive panel discussions and networking.

Nestlé will headline the event to explain its expectations of the packaging supply chain and its recently-released updated guidance note for printing inks, while Constantia Teich will present a real-life case study. Other speakers include EuPIA, the European printing ink association; Graphic Packaging International; Sartomer; Keller and Heckman, Agfa, and PIRA.

RadTech Europe has been focussing on food safety challenges and opportunities for several years, and has an established reputation for factual reporting as well as for thought leadership in this arena.

Register online
The RTE Food Packaging Seminar 2016 is open to both RadTech Europe members and non-members, and intending participants can register online at http://www.radtech-europe.com